Project Summary:
Future defense and space platforms require lightweight, multifunctional electronics capable of operating reliably in extreme thermal and environmental conditions. Yet today’s systems still rely on rigid, surface-mounted electronics that add mass, limit thermal performance, and reduce survivability. TRACE addresses this challenge by developing new approaches for integrating electronics into structural surfaces to improve efficiency, resilience, and thermal performance. Through advanced modeling, experiments, and prototype demonstrations, TRACE aims to enable resilient, low-SWaP (size, weight, and power) electronic systems for next-generation mission-critical platforms.
Principal Investigators:
Institution: University of Illinois, Chicago